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O and C from the as-received surface
This Specification defines the wetted surface characterization requirements and the finish acceptance criteria for tubing and components fabricated in stainless steel per SEMI F20 and intended to control or contain gases and liquids used in semiconductor manufacturing
The qualification processes cover:
The X-ray test method is nondestructive and yields the more precise measurement of orientation
the intercept cannot be interpreted as the diffusion length (refer to ¶ 3
M07700 - SEMI M77 - Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA StdPbc-0525 O and C from theWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The roll off amount (ROA) metric is suitable for quantifying near edge geometry of wafers used in semiconductor device processing. Consideration should be given to the use
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